Three-dimensional analytical models for predicting coating thickness on non-axial symmetrical workpieces in electron beam physical vapor deposition

If you need an accessible version of this item, please email your request to digschol@iu.edu so that they may create one and provide it to you.
Date
2022-08
Language
American English
Embargo Lift Date
Committee Members
Degree
Degree Year
Department
Grantor
Journal Title
Journal ISSN
Volume Title
Found At
Elsevier
Abstract

In this work, three-dimensional (3D) analytical models for non-axial symmetric workpieces, including ellipsoid and cylinder, are derived to predict the coating thickness distributions in the EB-PVD process. Additionally, 3D analytical models for axial symmetric workpieces, including disk and sphere are presented, which will be used for deriving the non-axial symmetric workpiece solutions. The models are based on extending the two-dimensional (2D) models of a disk workpiece by Schiller et al. (1982) and a circular arc on a cylinder by Fuke et al. (2005). The 3D models for disk and sphere workpieces are also presented which are used to derive the non-axial symmetric models. The results show that the 3D analytical models are consistent with the 2D models, and also in excellent agreement with our finite element (FE) model predictions and experimental data in the literature.

Description
item.page.description.tableofcontents
item.page.relation.haspart
Cite As
Li, Y., Ji, Z., Dhulipalla, A., Zhang, J., Yang, X., Dube, T., Kim, B.-G., Jung, Y.-G., Koo, D. D., & Zhang, J. (2022). Three-dimensional analytical models for predicting coating thickness on non-axial symmetrical workpieces in electron beam physical vapor deposition. CIRP Journal of Manufacturing Science and Technology, 38, 268–273. https://doi.org/10.1016/j.cirpj.2022.05.006
ISSN
Publisher
Series/Report
Sponsorship
Major
Extent
Identifier
Relation
Journal
CIRP Journal of Manufacturing Science and Technology
Source
Author
Alternative Title
Type
Article
Number
Volume
Conference Dates
Conference Host
Conference Location
Conference Name
Conference Panel
Conference Secretariat Location
Version
Author's manuscript
Full Text Available at
This item is under embargo {{howLong}}