Atomistic modeling of resistivity evolution of copper nanoparticle in intense pulsed light sintering process

Abstract

In this work, the intense pulsed light (IPL) sintering process of copper nanoparticle ink is simulated using molecular dynamics (MD) method. First, the neck size growth between the two copper nanoparticles during the IPL sintering process is computed. The resultant electrical resistivity is then calculated by substituting the neck size into the Reimann-Weber formula. Overall, a rapid decrease of electric resistivity is observed in the beginning of the sintering, which is caused by quick neck size growth, followed by a gradually decrease of resistivity. In addition, the correlation of the simulated temperature dependent resistivity is similar to that of the experimentally measured resistivity. The MD model is an effective tool for designers to optimize the IPL sintering process.